Call for Papers

    The primary objective of the World Congress on Condition Monitoring (WCCM) is to exchange worldwide research and application achievements on Condition Monitoring (CM) and related areas, with particular emphasis on scientific and technical development, industrial applications and cooperation worldwide. The Congress is aimed at providing a worldwide platform to scientists and practitioners in both academia and industry. The Congress main topics and sessions setting are as follows (other relevant topics are welcome).

    Sessions setting: Part I Signal detection and processing    detail
    Part II CM/NDT instrumentation and methods   detail
    Part III Diagnosis, assessment and prediction   detail
    Part IV CM of core components   detail
    Part V CM of systems and facilities   detail
    Part VI Advanced CM technology   detail

    Topics:

    ● Condition monitoring technologies and systems ● ITC for condition monitoring
    ● Structural health monitoring technologies and systems ● Repair and overhaul
    ● Architecture of condition monitoring systems ● Internet of things and services
    ● Wireless techniques and systems for condition monitoring ● Digitalization for condition monitoring
    ● Computational fluid dynamics for condition monitoring ● Failure consequences
    ● Robotics for condition monitoring and maintenance ● Root cause analysis: case studies
    ● Measurement for condition monitoring ● Failure assessment
    ● Condition monitoring and maintenance education ● Asset management systems
    ● Standards for condition monitoring and maintenance ● Life-cycle analysis for maintenance
    ● Communication for condition Monitoring ● Through-life support
    ● Risk based maintenance and risk management ● Fatigue and fracture
    ● Standard and new sensors and actuators ● Sustainability of complex assets
    ● Health & safety in maintenance ● Maintenance: case studies
    ● Design improvement via condition monitoring ● Physics of failure, failure modes
    ● Nano technologies for condition monitoring ● Model and data driven prognostics
    ● Fatigue and fracture prognosis ● Prognostics: case studies
    ● Design for optimal maintainability ● Energy harvesting sensors
    ● Root cause analysis of faults ● Root cause analysis techniques
    ● Maintenance management 4.0 strategy ● Sensor fusion
    ● Modelling for condition monitoring ● Data mining and fusion
    ● Condition monitoring: case studies ● Image processing
    ● Adaptation of condition monitoring technologies ● Embedded sensors
    ● Big data, data analytics and smart data management ● Finite element analysis
    ● Dynamical system analysis ● Modal analysis
    ● Computational methods for condition monitoring ● Equipment troubleshooting
    ● Materials, materials manufacturing and characterization ● Noise and vibration of assets
    ● Condition monitoring via performance characteristics ● Strain/Stress analysis
    ● High performance computing for condition monitoring systems
    ● Pattern recognition, machine learning and artificial intelligence
    ● Logistics and spare part management, maintenance supply chain
    ● Training and certification for condition monitoring and maintenance
    ● Hardware and software platforms for condition monitoring systems
    ● Reliability centered maintenance and reliability engineering and management
    ● Non-destructive testing and evaluation (NDTE): technologies and systems
    ● Linear, nonlinear, time, frequency and time-frequency signal processing
    ● Lubrication, tribology and tribo-vibroacoustics for condition monitoring

    Key Dates

  • • Submission of Abstract (Mandatory) : 31 July, 2024 31 August, 2024 (only for presentation)
  • • Submission of Camera-ready Abstract (Mandatory) : 31 July, 2024 31 August, 2024 (only for presentation)
  • • Submission of Paper* (Optional) : 31 July, 2024
    *For the Conference proceedings (After passing the peer review, it can be included in the proceedings.)
  • • Technical Sessions: October 15-18, 2024

    • Congress Proceedings

    The best WCCM papers will be published in a Special Issue of International journal “Electronics” , https://www.mdpi.com/journal/electronics , covered by the Science Citation Index Expanded (SCIE, Web of Science), impact factor is 2.4, that will be dedicated to the 3rd WCCM.
    Springer, covered by the Engineering Index (EI), will publish Congress Proceedings. Manuscripts, that will pass peer reviews will be published in the Proceedings.